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Open Call: Boosting Research and Innovation Cooperation between EU and Japan on Semiconductors

Open Call: Boosting Research and Innovation Cooperation between EU and Japan on Semiconductors US Philanthropy Networks Offer More Than Grants—They Offer Partnerships. Explore a “new” source of funding for NGOs “Purpose Meets Partnership – How to Leverage US Philanthropy Networks for Long-Term Funding:DOWNLOAD Deadlin…

15 juillet 2025· Mis à jour le 14 juillet 2025 2 min Partager
Illustration de l’article : Open Call: Boosting Research and Innovation Cooperation between EU and Japan on Semiconductors
Open Call: Boosting Research and Innovation Cooperation between EU and Japan on Semiconductors

US Philanthropy Networks Offer More Than Grants—They Offer Partnerships.

Explore a “new” source of funding for NGOs

“Purpose Meets Partnership – How to Leverage US Philanthropy Networks for Long-Term Funding:DOWNLOAD

Deadline: 17 September 2025

The European Commission has launched its call to better connect running and planned semiconductor R&I actions in both regions and to conceive follow-up actions for future joint R&I efforts.

Scope

  • The scope includes, but is not limited to, the following areas:
    • Organize and support networks, conferences, workshops and other actions that:
      • support semiconductor joint EU-Japan R&I activities, in particular to generate R&I priorities for potential future collaboration.
      • Connect EU and Japanese companies in the semiconductor value chain to exchange information and propose measures to improve chip supply chain stability.
    • Support exchange of researchers and closer coordination of running R&I activities in both regions which address equal or similar objectivities, for instance on the development of a reference database for Life Cycle Assessment or Green House Gas emission in semiconductor manufacturing processes.
    • Increased networking and collaboration of stakeholders from the EU and Japan with a view to addressing current needs, considering future requirements and stimulating long-term cooperation.
    • The action should ensure that relevant stakeholders from both the EU and Japan are engaged during the process through regional and international workshops and a set of communication and dissemination actions.

Funding Information

  • Budget (EUR) – Year 2025: 1 000 000
  • Contributions: 500000 to 1000000

Expected Outcomes

  • Coordinate ongoing Japanese and EU R&I activities on life cycle assessment (LCA) of semiconductor manufacturing processes and facilitate exchange of researchers to improve coherence.
  • Support joint R&I activities between the EU and Japan
  • Contribute to preparing potential future joint EU-Japan R&I collaboration topics in the field of semiconductors.
  • Explore opportunities to finance talent exchanges between R&D or production sites in both regions.
  • Foster increased cooperation with appropriate research institutions in Japan on the development, deployment and commercialisation of digital technologies, for example through specific collaboration in the field of R&I.
  • Support joint activities of companies in the semiconductor value chain to improve security of supply for chips.

For more information, visit EC.

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